What is MEMS Bonding? Bonding is the critical process of permanently joining two ultra-clean, atomically flat semiconductor wafers (homogeneous or heterogeneous) using intermolecular forces. As a foundational step in MEMS manufacturing, selecting the optimal bonding technique is paramount.
It directly determines your device's mechanical stability, hermetic sealing, and ultimate functional success. At Plutosemi, we've mastered a comprehensive portfolio of mature bonding technologies, expertly tailored to meet diverse customer requirements across substrates, thicknesses, temperatures, and pressures.
Applications:
Powering Cutting-Edge MEMS Devices
Our precision bonding technology is essential for manufacturing high-performance, reliable microelectronic components, including:
