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Advanced Packaging Is Turning Into a Fab — Here Is Why
1 、Say packaging and most people still think back-end: dicing, die attach, bonding, molding Yet todays advanced

10-10 / 2026
Silicon Capacitors Embedded Around the GPU Die
Why Capacitors Moved InsideAI chip power has climbed toward the kilowatt range, and when load spikes, current dem

09-23 / 2026
Memory & HBM: How AI Is Siphoning Off the Entire Memory Supply Chain
One Number Explains the SiphonThe memory industry has never lacked cycles, but this one is different Trend Force

09-15 / 2026
LPDDR6 Is Here: The 'Two-Lane Revolution' for AI Phones' Memory
1 Why LPDDR6 Exploded Onto the Scene The standard landed: JEDEC released LPDDR6 (JESD209-6) in July 2025, spanning

09-09 / 2026
Co-Packaged Optics (CPO): The Optical Interconnect Revolution in the Age of AI C
As GPU clusters scale beyond 10,000 cards, the power and bandwidth limits of copper interconnects can no longer

09-03 / 2026
Substrate Materials: The First Building Block of Chip Manufacturing
A chip’s performance ceiling is set the moment its substrate is chosen Silicon, SOI, SiC, fused silica

08-26 / 2026

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