Testing
Testing ensures every chip meets design specs through electrical, optical, and morphological verification across wafer fabrication, packaging, and final shipment.
Our Testing Equipment & Capabilities
PlutoSemi is equipped with a complete testing system covering material analysis, morphological characterization, electrical testing, optical performance evaluation, and packaging interconnection verification. We support 4/6/8-inch wafers and are compatible with a wide range of materials, including silicon, III-V compounds, thin-film lithium niobate, and 2D materials.
Core Capabilities Overview:
Material & Thin-Film Characterization – Spectral ellipsometer, profilometer, ECV, FTIR, UV-Vis-NIR. Capable of measuring film thickness (accuracy <0.005nm), refractive index, carrier concentration (10¹³–10²⁰/cm³), step height, etc.
Microscopic Morphology Analysis – FE-SEM, tungsten filament SEM, AFM, SPM, FIB/SEM. Resolution down to 0.8nm (STEM), supporting 3D topography, roughness measurement, and site-specific TEM sample preparation.
Optical Performance Testing – UV-Vis-NIR spectrophotometer, FTIR. Measures transmittance, reflectance, and absorption spectra (175–3300nm and infrared bands).
Electrical & Device Testing – ECV, wafer-level probe testing. Analyzes doping concentration and device functional parameters.
Packaging Interconnection Verification – Die placement accuracy ≤±1μm, bond quality inspection, and other auxiliary testing capabilities.
