EVG UV Exposure Machine
Model: EVG620NT
Manufacturer: Austria EVG
Main Function: Wafer alignment before photolithography and bonding
Technical Specifications: Manual wafer loading supports hard contact, soft contact, proximity, and vacuum contact exposure modes; photolithography supports up to 4-inch substrates, pre-bond alignment for 2, 3, and 4-inch wafers; UV-LED light source (including I-line (365nm), H-line (405nm), and G-line (436nm)), light intensity uniformity: ≤ 4%, exposure resolution ≤ 0.8μm; dual-side visible light alignment accuracy front ±0.5μm, back ±1μm
