Plasma-Enhanced Chemical Vapor Deposition (PECVD)
Model: PlasmaPro 800Plus Stratum PECVD
Manufacturer: Oxford Instruments, UK
Main Functions: Deposition of SiO2 and SiNx insulating layers and dielectric films in semiconductor processes, used for mask fabrication in device processes to assist high-quality dry etching processes with micro-nano line widths; deposition of insulating and barrier layers to assist in the creation of current injection channels in optoelectronic devices.
Technical Specifications: Lower electrode diameter 460mm, temperature control range: 100 to 350℃. RF frequency 13.56 MHz, RF power 600W. Equipped with 600W, 100kHz low frequency for controlling film stress. Five process gas lines, including: 5% SiH4, NH3, N2O, N2, 80% CF4/20% O2
