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Material Growth Process
8-Inch Magnetron Sputtering Coating Machine
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Product Detail

8-Inch Magnetron Sputtering Coating Machine  

Model: JCPY600  
Manufacturer: Beijing Techno Technology Co., Ltd.  
Main Function: The platform provides targets for the following materials: Al, Cr, Ni-Cr (80Ni:20Cr wt%), Ti, Cu, SiO2, W. Other materials must provide their own targets.  
Technical Specifications: Sample tray for 8-inch and 4-inch. Maximum sputtering area is 8 inches. Target size is 100mm in diameter. Existing target is Cr. Gases: argon, oxygen, nitrogen. Sputtering method: DC/RF. 4 target positions. Substrate can be heated to 500℃.
 
Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
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