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Material Growth Process
HDG Ion Beam Sputtering / Etching System
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HDG Ion Beam Sputtering / Etching System  

Model: Discovery HDG  
Manufacturer: DENTON Vacuum, USA  
Main Function: Sputtering / Etching  
Technical Specifications: Sputtering source: Veeco 6cm dual-grid (molybdenum) RF ion source and power supply;  
Three-way gas inlet control (20sccm, 2 at 10sccm);  
Cleaning / etching source: Veeco 16cm triple-grid (molybdenum) RF ion source and water-cooled power supply;  
Target holder can install 4 targets of 5 inches in diameter;  
Rotating 8-inch workpiece tray, bonded with 1 oxygen-free copper piece of 6 inches in diameter, can be back-heated to 500 degrees, single-channel Speedflo reactive gas feedback control system.  
Ion energy: 100 eV to 2000 eV continuously adjustable,  
Film uniformity within a diameter of 6 inches better than ±1.5%, coating repeatability better than ±1.5%; etching uniformity within a diameter of 6 inches better than ±5%, etching repeatability better than ±3%
 
Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
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