Inductively Coupled Plasma Etching Machine
Model: Plasmalab system 100 ICP180
Manufacturer: OXFORD INSTRUMENTS, UK
Main Function: Primarily used for etching Si materials, applicable in the fabrication of micro-nano waveguides, micro-electromechanical systems (MEMS), micro-cavities, and other devices.
Technical Specifications: Gases: CHF3\SF6\C4F8\Ar\O2
Usage: Mainly for etching Si materials, such as 220nm SOI, shallow silicon, etc.
Size: 4 inches and below; Temperature: 0 - 60℃; Masks: Cr, PR, SiO2
