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Etching Process
Inductively Coupled Plasma Etching Machine | Model: PlasmaPro Cobra 300
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Inductively Coupled Plasma Etching Machine  

Model: PlasmaPro Cobra 300  
Manufacturer: Oxford Instruments Plasma Technology, UK  
Main Function: Etching of III-V compound semiconductors, such as InP, GaAs, GaN, AlN, GaP, etc.  
Technical Specifications: Maximum sample support of 8 inches. Existing pressure ring for 4 inches.  
Gas types and maximum flow rates (sccm): Ar: 100, O2: 20, O2: 200, SF6: 100,  
CHF3: 100, CF4: 100, N2: 100, H2: 100, CH4: 100, Cl2: 100, BCl3: 100.  
RF power 600W (13.56MHz), ICP power 3000W (2MHz).  
Equipped with ALE atomic layer etching function. Temperature range -20℃ to 400℃.
 
Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
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