Silicon Through-Silicon Via (TSV) Etching Machine
Main Function: Used for deep silicon etching of 8-inch through-silicon vias, and downward compatible with deep silicon etching applications for other sizes of silicon wafers. Features Bosch process and Cryo low-temperature liquid nitrogen etching process.
Technical Specifications: Etch rate (µm/min) 6.37; Selectivity 90; Sidewall Angle 90.3°; Scallop Size (nm) 91.6
