|
Category |
Specification |
|
Device Type |
Wafer-level TGV equipment |
|
Model |
DSI-G-STC-1001-A |
|
Technology |
Femtosecond laser-induced enhanced glass etching (FLEE-TGV) |
|
Wafer Size Compatibility |
4-12 inches (full-size compatible up to 300mm) |
|
Substrate Thickness Range |
0.1mm ~ 1mm |
|
Minimum Achievable Hole Diameter |
<5µm |
|
Maximum Achievable Aspect Ratio |
≥50:1 |
|
Processing Efficiency |
≥5,000 holes/second |
|
Taper Angle |
1° ~ 10° (dependent on glass material) |
|
Positioning Accuracy |
±5µm |
|
Hole Position Accuracy |
3µm |
|
Running Speed |
≥800mm/s |
|
Hole Circularity (Outer/Inner) |
≥95% (major axis/minor axis) |
|
Hole Wall Quality |
≤100nm |
|
Applicable Industries |
Advanced packaging, display manufacturing, consumer electronics, life sciences |
