High-Precision Circuit Printing and Chip Mounting Integrated Machine
Model: EHDJET-FC
Manufacturer: Guangdong Sigu Intelligent Technology Co., Ltd.
Main Function: Integrates the function of printing micro-level circuits, solder points, and other electronic patterns using conductive materials such as nano silver paste, as well as microchip mounting, for the integration of microelectronic devices, MicroLED wafer repair, and mounting technologies.
Technical Specifications: Adaptable printing materials: viscosity ≤100000cps high-conductivity nano paste
Solder compatible chip sizes | 0402, 0201, etc., sizes 0.2mm-2mm; adjustment accuracy: 1kPa solder injection
Dot rate ≥5 dots/s printing capability
Printing line width/dot: ≥5μm, speed ≤200mm/s
Repeatability ≤3μm
In-situ mounting accuracy ≤10μm
