Wafer Dicing Path Direct Write Filling Equipment
Model: CMS-DW300
Manufacturer: Wuhan Digital Design and Manufacturing Innovation Center Co., Ltd.
Main Function: Used for direct write filling of nano slurry in wafer dicing paths and chip spacing gaps, suitable for channel width ≥50μm, depth ≤50μm. This equipment can be customized based on wafer size, channel size, etc., aimed at high-end chip advanced manufacturing needs. Based on 3D stacking technology, Chiplet to wafer process, it manufactures Chiplets through wafer dicing, stacks Chiplets with the wafer, and then performs direct write filling in the gaps between the dicing channels, i.e., between Chiplets.
Technical Specifications: Motion Platform: Air float isolation, motion positioning accuracy ≤1μm
Wafer Base: Suitable for ≤12-inch wafers, dedicated ceramic base flatness ≤5μm
Rotation: Repeat positioning accuracy ≤±1 arcsec
Auxiliary Vision: Positioning vision camera alignment accuracy ≤1μm, observation camera can detect distance
Laser Detection: Automatically scans the wafer, can automatically find wafer edges, identify channels, and plan direct write filling routes
Direct Write Channels: 1, expandable to 2, direct write speed ≤200mm/s
