Ultra-thin Large Chip High-Precision Stacking Equipment
Model: CMT-FC300
Manufacturer: Wuhan Digital Design and Manufacturing Innovation Center Co., Ltd.
Main Function: Primarily achieves non-destructive transfer of large-size ultra-thin chips, high-precision alignment, and ion bonding/stacking with wafers, as well as flip-chip bonding.
Technical Specifications: Applicable Chip Size: ≤13mm*13mm, thickness ≤30μm
Bonding Accuracy: Auxiliary in-situ top/bottom view positioning camera, multi-degree of freedom high-precision adjustment for chip posture, achieving mounting accuracy ≤±1μm
Precision Vision Alignment: Accuracy ≤1μm
Chip Peeling: Uses multi-top chip peeling technology for non-destructive peeling of ultra-thin large chips
Pick and Transfer: Customizable swirling pick-up, air flow suspension for chips, achieving contactless transfer
Mounting Bonding: Uses self-developed micro-spherical mounting head, picks up ultra-thin chips into micro-spheres, gradually bonding from chip center to edge, ensuring bubble-free mounting and high-reliability bonding
Applicable Wafer Size: ≤12 inches
