Packaging testing equipment
Product Detail
EVG Bonding Machine
Main Function: To achieve hybrid integration of silicon-based and III-V group, multi-material system chips, preparing lasers, modulators, integrated chips, etc.
Technical Specifications: 2-4 inch wafer bonding; supports fusion direct bonding, eutectic bonding, metal diffusion bonding, glass adhesive bonding, and other thermal pressure bonding processes;
Maximum bonding pressure 20KN; bonding temperature: room temperature - 500℃; pressure control accuracy ≤±3%.
