Packaging testing equipment
Product Detail
Wire Bonding Machine
Model: HB05
Manufacturer: TPT
Main Function: Uses fine gold wire and aluminum wire, utilizing ultrasonic energy to tightly bond metal leads to substrate pads, achieving interconnection between chip and substrate pads.
Technical Specifications: Gold wire diameter 25μm, capable of ball bonding, wedge bonding, and bump bonding;
Aluminum wire diameter 25μm, capable of wedge bonding.
Worktable can be heated, maximum 250℃
