Packaging testing equipment
Product Detail
MOT Electroplating Gold
Model: Wafer Electroplating System, μ GALV-R&D+
Manufacturer: M-O-T Mikro-und Oberflächentechnik GmbH
Main Function: Electroplating gold is a process that uses electrochemical methods to deposit a gold layer on the substrate surface using environmentally friendly cyanide-free plating solution. It can be used in various stages of integrated circuit chip packaging, such as gold plating for lead frames, chip pins, solder ball connections, etc.
Technical Specifications: Electroplating thickness uniformity between wafers better than 5%, repeatability better than 5%
