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Grinding and Polishing Machine
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Product Detail

Grinding and Polishing Machine  

Model: TSP-450  
Manufacturer: Beijing Tesdi Semiconductor Equipment Co., Ltd.  
Main Function: Grinding, polishing  
Technical Specifications: Removal rate ≥2500A/min, TTV ≤3μm, post-polishing uniformity ≤5%, roughness ≤1nm
 
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