Packaging testing equipment
Product Detail
Chemical Mechanical Polishing Machine
Manufacturer Model: Korea CTS-AP 200
Main Function: Precise thinning and polishing of 4, 6, 8-inch silicon and silicon oxide wafers
Technical Specifications:
(1) In-wafer uniformity: using SiO2 polishing recipe, WIWNU ≤5%
(2) Inter-wafer uniformity: using SiO2 recipe, WTWNU < 3%
(3) Post-polishing roughness: post-polishing surface roughness Ra < 0.5 nm;
(4) Removal rate: SiO2 (@ TEOS): 300±40 nm/min;
