RCA Cleaning Machine
Model: CHEMIXX CMP 30pm
Manufacturer: Germany Osiris
Main Function: This equipment is mainly used for non-destructive cleaning of SiO2 films, Si3N4 films, and Si substrates after flattening polishing processes in wafer manufacturing, semiconductor production, and optical device manufacturing.
Technical Specifications:
(1) PVA brush speed: 0-100rpm
(2) Cleaning machine double-sided fixture speed: 0-100rpm
(3) High-speed spin-dry speed: 0-1500rpm
(4) Fully automated chemical liquid arm, flow rate, flow speed, process time, and other parameters can be set via software
(5) Cleaning machine motor speed: maximum 6,000rpm, step 1rpm, programmable
(6) Process time: 1 - 999.9 seconds, step 0.1 s, programmable
