Silicon-based Micro-nano Process Line
Process and Equipment
● Photolithography System: Nikoni9 stepper (line width ≤ 500nm), Vistec EBPG electron beam lithography (≤ 10nm)
● Etching Equipment: Oxford Instruments plasma etcher (deep silicon etching aspect ratio > 20:1)
● Thin Film Equipment: OIPT PECVD (film uniformity within ±3%), Tystar LPCVD (TEOS SiO2/Si3N4 dielectric layer/polycrystalline silicon)
● Characterization Instruments: SEM, step profiler, ellipsometer
Service Item
Small batch chip trial production: IoT node chips, RF devices, process optimization consulting
Failure analysis: SEM/FIB microstructure diagnosis
Full entrusted OEM: One-stop solution for silicon-based micro-nano technology challenges from design to tape-out
SOI tape-out: Providing multi-project wafer foundry services
Typical preparation devices
MEMS Accelerometer
SOI Modulator
AR/VR Optical Master Template
RF Filter
