Multi-Material System Process Line
Process and Equipment
●Photolithography System: EVG Photolithography and Bonding Alignment System
● Etching Equipment: Reactive Ion Etching Machine
● Bonding Equipment: EVG Bonding Machine
Service Item
● Using EVG bonding machine for BCB bonding of wafers made of different materials
● Based on TSV deep silicon etching, electroplating, back thinning, and other complete processes,
interconnecting through silicon wafers to prepare three -dimensional chips that surpass Moore 's Law.
Typical preparation devices
Performance Tuning of Two-Dimensional Material
MoS2 Photodetectors
Graphene Quan tum Hall Device Diagram
