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Thin Film Deposition Process Service: 8-inch Wafers · 70nm Lift-off Line Width

Thin Film Deposition Process Service: 8-inch Wafers · 70nm Lift-off Line Width

What is Thin Film Deposition?

Simply put, thin film deposition is the process of "coating" a nano-scale thin film layer onto a wafer.
It is a fundamental skill in micro-nano fabrication, yet it determines the upper limit of device performance. The film, ranging in thickness from a few nanometers to several micrometers, can serve as:
Insulating Layer: Keeping circuits isolated
Conductive Electrode: Providing electrical interconnection for the chip
Hard Mask: Aiding the etching process as a protective stencil
Optical Film: Enhancing transmission or reflection for optical devices

Thin Film Deposition Primarily Falls into Two Categories

Chemical Vapor Deposition (CVD)
A film "grows" on the substrate surface through chemical reactions, suitable for dielectric materials such as silicon oxide and silicon nitride. This method is akin to applying a nourishing mask – slow and permeating.
 
Physical Vapor Deposition (PVD)
Materials are "sputtered" or "evaporated" onto the substrate using physical methods, including magnetron sputtering and electron beam evaporation. Suitable for metals and alloys such as gold, silver, and titanium – as clean and crisp as spray painting.

Our Process Capabilities

With years of experience in the thin film deposition field, we offer deposition processing services for various wafers and pieces up to 8 inches, with a comprehensive range of materials.
 
CVD Process Dielectric Thin Films
Silicon oxide, silicon nitride – available as needed.
 
PVD Process Metal Thin Films
Gold, silver, aluminum, titanium, nickel, chromium – metal oxide and alloy films can also be customized upon request.
 
Process Highlight
Deposition-lift-off line width achievable down to 70nm – meeting high-precision patterning requirements and capturing the finest details.

Equipment Configuration

 

Equipment Quantity
PECVD Deposition System 2 units
Magnetron Sputtering System 2 units
Electron Beam Evaporator 1 unit
Optical Coating System 1 unit
Rapid Thermal Annealing (RTA) Furnace 1 unit
Tube Annealing Furnace 1 unit
Semi-automatic Cleaner 1 unit
Wafer Dryer 1 unit
 
Whether you are from a university research group or a corporate R&D center, feel free to reach out. We can help you avoid some detours along the way.
 
Contact
Lance Xie
Email: lance@plutosemi.com
PlutoSemi

 


Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
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