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Foundry
MEMS Process
PI
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Semi-Automatic RCA Cleaning System
Rapid Thermal Annealing（RTA）Furnace
Ion Implantation System
Reactive Ion Etching (RIE) System
Xenon Difluoride Etching System
HF Vapor Etching System
Deep Reactive Ion Etching System
Ion Beam Etching System
Inductively Coupled Plasma (ICP) Etching System
Atomic Layer Deposition System
Plasma-Enhanced Chemical Vapor Deposition (PECVD) System
Inductively Coupled Plasma Chemical Vapor Deposition (ICP-CVD) System
Laser Direct Writing System
Double-Side Mask Aligner
Stepper Lithography Machine
MEMS Product
Thermopile Introduction
Process Nod-1.5um
Process Nod-100nm
SiC
Foundry
MEMS Process
PI
Bonding
Etching
COATING PROCESS
Lithography
PDMS
TSV
MASK
Ion Implantation
Equipment
Dual-Carrier Spin Dryer
Radio Frequency (RF) Plasma Stripper
Microwave Plasma Stripper
ICPCVD System
LPCVD System
Semi-Automatic RCA Cleaning System
Rapid Thermal Annealing（RTA）Furnace
Ion Implantation System
Reactive Ion Etching (RIE) System
Xenon Difluoride Etching System
HF Vapor Etching System
Deep Reactive Ion Etching System
Ion Beam Etching System
Inductively Coupled Plasma (ICP) Etching System
Atomic Layer Deposition System
Plasma-Enhanced Chemical Vapor Deposition (PECVD) System
Inductively Coupled Plasma Chemical Vapor Deposition (ICP-CVD) System
Laser Direct Writing System
Double-Side Mask Aligner
Stepper Lithography Machine
MEMS Product
Thermopile Introduction
Process Nod-1.5um
Process Nod-100nm
SiC
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Sub 2: PlutoSilica Co., Ltd -Silicon Wafer and Glass Wafer Manufactory-
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