What is MEMS Bonding?

Bonding is the critical process of permanently joining two ultra-clean, atomically flat semiconductor wafers (homogeneous or heterogeneous) using intermolecular forces. As a foundational step in MEMS manufacturing, selecting the optimal bonding technique is paramount.

 

It directly determines your device's mechanical stability, hermetic sealing, and ultimate functional success. At Plutosemi, we've mastered a comprehensive portfolio of mature bonding technologies, expertly tailored to meet diverse customer requirements across substrates, thicknesses, temperatures, and pressures.

 

Applications:

Powering Cutting-Edge MEMS Devices

Our precision bonding technology is essential for manufacturing high-performance, reliable microelectronic components, including:

 

Microcavity Devices (e.g., pressure sensors, resonators, IR imagers)

Cantilever Beam Structures (e.g., accelerometers, AFM probes)

Devices Utilizing Sacrificial Layers

Complex & Custom 3D MEMS Structures

 

Capabilities:

Our Advanced Bonding Expertise

Plutosemi delivers robust and reliable bonding solutions for your most demanding applications:

 

Anodic Bonding: Ideal for glass-to-silicon hermetic seals

 

Eutectic Bonding: High-strength metal alloy bonds (AuSn, CuSn, AuSi, etc.)

 

Adhesive Bonding: Versatile solutions using specialized adhesives (AZ4620, SU8)

 

Thermocompression Bonding: For robust interconnects

 

Multi-Layer Bonding: Complex stack assembly

 

Silicon Fusion Bonding: Direct Si-to-Si joining for high integrity

 

Inverted Bonding: Enabling unique device architectures