Double-Side Mask Aligner | EVG 620NT
Capabilities：
Advanced double-side mask alignment system supporting front-to-back and bond alignment processes with 0.8 μm minimum feature size. Enables high-precision lithography for MEMS, sensors, and advanced packaging applications requiring dual-side patterning accuracy.
Technical Specifications：
Substrate size: fragments/2/4/6 inch
Double-side alignment capability
Bond alignment function
Minimum linewidth: 0.8 μm
Intensity uniformity: ≤3%
Front-side alignment accuracy: ≤0.5 μm
Back-side alignment accuracy: ≤1 μm
Process Advantages：
Superior alignment precision for dual-side processes
Excellent exposure uniformity ensures consistent patterning
Versatile substrate handling supports various sample sizes
Integrated bond alignment enables advanced 3D integration
Primary Applications：
MEMS device fabrication
Sensor manufacturing
Advanced packaging processes
3D integration and TSV applications
Why Choose Our Service？
We provide precision double-side alignment with ≤0.5 μm front-side and ≤1 μm back-side accuracy using industry-proven technology. Our system's versatile substrate handling and bond alignment capabilities ensure reliable patterning for your most demanding MEMS, sensor, and 3D integration applications. Partner with us to achieve perfect alignment in your dual-side lithography processes.
