Capabilities: Standard RCA Full Process Cleaning
Complete RCA Process Implementation: Sequentially removes organic contamination, particle contamination, metal contamination, and surface native oxide layer from wafer surfaces.

Chemical Tank System: SPM, DHF, SC1, SC2, covering the entire RCA process flow.

SPM Tank Maximum Heating Temperature: 130°C, enhancing organic contaminant removal.

Robotic Arm Operation (covering SPM tank and high-temperature QDR tank), ensuring process safety and consistency.

H₂O₂ Automatic Replenishment & Local CDS Automatic Supply, ensuring chemical stability.

Replenishment Accuracy: ≤0.5%, guaranteeing precise process parameter control.

Megasonic Power: 600 W, enhancing cleaning effectiveness.

SPM (H₂SO₄/H₂O₂): Efficiently removes organic contaminants at 130°C high temperature.

DHF (Diluted HF): Clears surface native oxide layer and partial metal residues.

SC1 (NH₄OH/H₂O₂/H₂O): Combines 600W megasonic energy to forcefully remove particle contaminants.

SC2 (HCl/H₂O₂/H₂O): Targets metal ion contamination.
Automated chemical supply (H₂O₂/CDS) and ≤0.5% replenishment accuracy ensure process repeatability.

Semiconductor Wafer Manufacturing: Pre-diffusion/photolithography residue removal in front-end silicon wafer cleaning.

MEMS Device Processing: Post-release cleaning of microstructures to remove particles and metal contaminants.

Optoelectronic Substrate Treatment: Surface pretreatment of compound semiconductors (e.g., GaAs, InP).

RCA Cleaning Process Expertise: Based on Hualin KeNa custom system, specializing in the standard four-step RCA cleaning process.

Stable and Reliable Cleaning Platform: ≤0.5% replenishment accuracy and automated supply (H₂O₂/CDS) ensure chemical ratio consistency.

Efficient Contaminant Removal: 130°C SPM tank enhances organic cleaning; 600W megasonic boosts particle removal.

Safe Semi-Automated Operation: Robotic arm handling of SPM and high-temperature QDR tanks reduces manual contact risks.

Flexible Process Support: Complete SPM/DHF/SC1/SC2 tank configuration meets diverse cleaning needs.