The CETC 45th Institute CXS-21505 Dual-Carrier Spin Dryer delivers precision wafer cleaning and spin-drying for semiconductor manufacturing. Designed to minimize defects and maximize yield, it ensures ultra-clean, damage-free processing for advanced nodes, MEMS, and packaging applications.
Wafer Cleaning & Drying: Combines high-speed rotation with nitrogen purge for residue-free, moisture-free, and particle-free results.
ESD-Safe Handling: Integrated electrostatic discharge control protects sensitive devices during processing.
Surface Protection: Nitrogen-purged chambers prevent contamination and oxidation for critical surface-sensitive steps.
Wafer Compatibility: 2″ to 8″ wafers
Rotor Speed: 300–2400 RPM (continuously adjustable)
Breakage Rate: ≤1/10,000
Added Particles: <30 particles (≥0.3 μm)
Key Features: Nitrogen purge, rotating carrier positioning, dual-carrier batch processing
Semiconductor foundry services
MEMS and sensor fabrication
Advanced packaging and 3D integration
Post-etch and post-CMP cleaning
R&D and pilot production support
We provide precision wafer drying with industry-leading cleanliness (<30 added particles) and breakage rates (≤1/10,000). Our dual-carrier systems ensure high-throughput processing for 2" to 8" wafers, delivering residue-free surfaces through optimized nitrogen purging and spin technology. Trust our expertise to enhance yield and accelerate your semiconductor, MEMS, and advanced packaging production.
