Semi-Automatic Acid Etcher | HualinkeNa Customized
Capabilities:
The HualinkeNa Semi-Automatic Acid Etcher delivers precision wet etching for dielectric film processing. Designed for exceptional process control and repeatability, it enables precise pattern transfer and surface preparation for advanced semiconductor devices, MEMS, and power electronics.
Key Process Modules:
Dielectric Film Etching: Provides controlled etching of multiple dielectric materials including SiO₂, PSG, and Si₃N₄ with high uniformity and selectivity.
Chemical Management: Automated chemical supply and circulation system maintains consistent chemical concentration and temperature for repeatable etch results.
Robotic Wafer Handling: Integrated robotic transfer between process tanks minimizes manual intervention and reduces contamination risk.
Technical Specifications:
Chemical Circulation: ≥15 L/min with ≤0.2 μm filtration
Temperature Range: H₃PO₄ tank heating to 160°C maximum
Chemical System: Local CD5 automatic supply
Configuration: Multiple acid tanks (H₃PO₄, BOE, HF) with robotic transfer capability
Process Advantages:
Process Consistency: Maintained chemical purity and temperature stability ensure predictable etch rates and uniform results across batches.
Operational Efficiency: Automated chemical management and robotic handling enhance throughput while reducing manual intervention.
Process Flexibility: Multiple dedicated acid tanks enable handling of diverse dielectric materials and process requirements.
Primary Applications:
Semiconductor foundry services
MEMS and sensor fabrication
Power device manufacturing
R&D and pilot production
Why Choose Our Service？
We deliver highly uniform dielectric etching for SiO₂, PSG, and Si₃N₄ films. Our automated systems ensure exceptional process control with robotic handling and multi-tank configuration. Accelerate your semiconductor and MEMS development with our contamination-free processing and reliable results. Partner with us for efficient R&D and production solutions.
