Automatic Photoresist Stripper System | Quanxin Wei AST61-111
Capabilities:
The Quanxin Wei AST61-111 is a fully automated stripping and lift-off system designed for precision photoresist removal and metal lift-off processes. It supports wafers from 2 to 6 inches, delivering high efficiency and consistency for semiconductor fabrication, advanced packaging, and R&D applications.
Key Process Modules:
Soaking Unit: Pre-treatment for enhanced stripping performance
Stripping Unit: High-pressure NMP spray for thorough photoresist removal
Cleaning Unit: High-pressure IPA rinse (up to 23 MPa) for residue-free surfaces
Robotic Transfer Unit: Fully automated wafer handling for minimal contamination
Technical Specifications:
Wafer Size Compatibility: 2, 3, 4, 6 inches
Chemical Delivery: Local CDS automatic dispensing
Stripping Method: High-pressure NMP spray
IPA Cleaning Pressure: Up to 23 MPa
Added Particles: <30 counts (at 0.3 μm diameter)
Process Advantages:
High Throughput & Automation: Robotic transfer reduces manual intervention and boosts productivity.
Superior Cleaning Performance: Combines high-pressure NMP stripping and IPA cleaning for complete residue removal.
Low Contamination Risk: Particle addition controlled below 30 counts, ensuring wafer surface integrity.
Flexible Configuration: Compatible with multiple wafer sizes and integrated process modules for versatile applications.
Primary Applications:
Semiconductor device manufacturing
Metal lift-off processes in microelectronics
Photoresist stripping in MEMS and sensor production
R&D and pilot lines for advanced materials and processes
Why Choose the Quanxin Wei AST61-111:
We provide precision photoresist removal and metal lift-off solutions using fully automated stripping technology. Our service guarantees complete residue-free cleaning with high-pressure NMP and IPA processes, while maintaining exceptional surface integrity (<30 added particles at 0.3μm). Supporting wafers from 2 to 6 inches, we deliver high throughput and contamination-controlled processing for your semiconductor, MEMS, and advanced packaging applications. Partner with us to enhance yield and accelerate your R&D and pilot production with reliable, automated stripping solutions.
