Magnetron Sputtering System | Alliance Concept AC450
Capabilities:
A versatile multi-target sputtering system designed for depositing high-quality metallic thin films including Al, Ti/TiN, Cu, and precious metals. Ideal for semiconductor metallization, MEMS fabrication, and advanced materials research requiring precise metal coating solutions.
Technical Specifications:
4 water-cooled magnetron targets (100mm)
Rotatable and heated substrate stage
Comprehensive power supply suite: DC, pulsed DC, and RF
Film thickness uniformity: ≤ ±3% across wafer
Supports up to 8-inch wafers and sample fragments
Process Advantages:
Multi-target configuration enables complex layer structures
Advanced power supplies optimize deposition for various materials
Heated rotating stage ensures excellent thickness uniformity
Water-cooled targets maintain stable long-term operation
Primary Applications:
Semiconductor interconnect metallization
MEMS and sensor electrode fabrication
Protective and functional coatings
Research and development of novel metal film structures
Why Choose Our Survice？
We deliver high-quality metallic thin films including Al, Ti/TiN, Cu, and precious metals with guaranteed ≤±3% uniformity for reliable device performance. Our multi-target sputtering system enables complex layer structures and precise process control, ensuring faster development cycles and higher yield for your semiconductor metallization, MEMS fabrication, and advanced coating projects. Partner with us to advance your interconnect and electrode applications with proven expertise in multi-material deposition.
