Thermal Evaporation Metal Deposition System | Denton E14
Capabilities:
A reliable thermal evaporation system specifically designed for depositing high-purity conventional metal films such as Al, Ti, Ni, Pt, and Au. Ideal for electrode fabrication, metallization processes, and fundamental materials research requiring consistent metal coating performance.
Technical Specifications:
2 kW power supply with precision thickness monitoring
Optimized source-to-substrate distance (≤520 mm)
≤5% thickness uniformity across wafer
Substrate heating to 300°C
Handles 4-inch to 8-inch wafers and smaller samples
Process Advantages:
High-purity metal films through controlled thermal evaporation
Excellent thickness uniformity across various substrate sizes
Flexible configuration supports diverse metal deposition requirements
Proven reliability for routine metallization processes
Primary Applications:
Semiconductor electrode fabrication
MEMS and sensor metallization
Research and educational laboratories
Prototype device development
Why Choose Our Evaporation Service?
We deliver high-purity Al, Ti, Ni, Pt, and Au films with guaranteed ≤5% uniformity for consistent device performance. Our dedicated line ensures fast turnaround and high yield for your R&D and pilot production, making us a reliable partner for your critical metallization steps.
