3D Laser Confocal Microscope | ZEISS LSM900 System
Capabilities:
The ZEISS LSM900 3D laser confocal microscope acquires detailed 3D topography of sample surfaces, enabling effective characterization of surface roughness and microstructure geometry. Designed for high-resolution imaging and measurement in materials science, semiconductor inspection, and precision engineering applications.
Technical Specifications:
Objective Lenses: 6 objectives (5× – 100× magnification)
Key Function: 3D imaging capability
Lateral Resolution: ≤ 120 nm image resolution, 6K × 6K
Height Display Resolution: 0.1 nm
Measurement Repeatability: ≤ 0.02 μm
Laser Source: Wavelength 405 nm, Power 5 mW
Process Advantages:
High-resolution 3D surface topography acquisition
Precise measurement of surface roughness and microstructure dimensions
Multi-magnification options for flexible imaging scales
High repeatability ensures measurement consistency
Non-contact optical measurement preserves sample integrity
Primary Applications:
3D surface topography acquisition and characterization of surface roughness and microstructure geometry in materials research, semiconductor metrology, and precision component inspection.
Why Choose Our Service?
Our expertise in high-resolution 3D microscopy delivers precise surface characterization essential for your quality control and R&D needs. Using the ZEISS LSM900 system, we provide detailed 3D topography data and accurate geometric measurements—supporting your surface analysis, process validation, and product development with reliable imaging solutions tailored to your specific inspection requirements.
