Wafer Thinning System | TSID Precision System
Capabilities:
Our advanced wafer thinning system effectively removes excess material from wafer backsides, reducing package volume, lowering thermal resistance, and improving device heat dissipation performance.
Technical Specifications:
Process Control: In-situ thickness control system
Surface Finish: Post-grinding roughness ≤ 20nm
Process Automation: Automatic switching between coarse and fine grinding
Thickness Uniformity: Within-wafer thickness variation ≤ ±3µm, wafer-to-wafer variation ≤ ±3µm
Wafer Compatibility: 4-inch, 6-inch, and 8-inch wafers
Process Advantages:
Precise thickness control with in-situ monitoring
Excellent surface finish for reduced post-processing
Automated process switching for consistent results
High thickness uniformity across wafers and batches
Multi-wafer size compatibility for flexible production
Primary Applications:
Wafer backside material removal for reduced package volume, lower thermal resistance, and improved heat dissipation in semiconductor device manufacturing.
Why Choose Our Service:
Partner with us for wafer thinning solutions that enhance your device performance and packaging efficiency. We deliver the precision, uniformity, and process control needed for your most demanding thinning applications, ensuring your wafers meet exact thickness specifications while optimizing thermal performance through our proven thinning expertise and dedicated technical support.
