Chemical Mechanical Polishing System | CTS AP-200 System
Capabilities:
Our advanced chemical mechanical polishing (CMP) system achieves film planarization and polishing by smoothing uneven thin film surfaces on wafers. Designed for precision surface finishing in semiconductor manufacturing.
Technical Specifications:
Polishing Platen Diameter: 20 inches
Wafer Carrier Pressure Control: 3-zone adjustable pressure system
Wafer Carrier Pressure Range: 0.14–14 psi
Wafer Size Compatibility: 4-inch and 6-inch wafers
Process Monitoring: Temperature monitoring and motor drive current endpoint detection
Process Advantages:
Multi-zone pressure control enables optimized polishing uniformity
Wide pressure range supports diverse material removal requirements
Real-time temperature monitoring ensures process stability
Endpoint detection via motor current enhances process control
Dual wafer size compatibility increases operational flexibility
Primary Applications:
Film planarization and polishing through surface smoothing of uneven thin films on wafers in semiconductor manufacturing processes
Why Choose Our Service？
Partner with us for CMP solutions that deliver the surface quality and uniformity your semiconductor processes require. We provide the precision control, process monitoring, and technical expertise needed for your most demanding planarization applications, ensuring your wafers achieve optimal surface flatness while maintaining film integrity through our proven polishing capabilities and dedicated technical support.
