Four-Point Probe Measurement System | KLA R50-4PP System
Capabilities:
Our advanced four-point probe measurement system provides precise resistivity measurement on wafer surfaces, delivering accurate sheet resistance characterization for semiconductor process control and materials analysis.
Technical Specifications:
Measurement Accuracy: ≤ 1%
Measurement Repeatability: ≤ 0.2%
Wafer Size Compatibility: Up to 8-inch wafers
Data Analysis: 2D & 3D data analysis capability
Probe Material: Tungsten carbide probes with adjustable contact pressure
Sheet Resistance Measurement Range: 5 mOhm/sq – 5 MOhm/sq
Process Advantages:
High measurement accuracy ensures reliable process monitoring
Excellent repeatability delivers consistent, trustworthy results
Broad sheet resistance range accommodates diverse materials and applications
2D and 3D data analysis enables comprehensive uniformity visualization
Adjustable probe pressure optimizes contact for various film types
Tungsten carbide probes provide durability and stable performance
Primary Applications:
Wafer surface resistivity measurement and sheet resistance characterization in semiconductor manufacturing, thin film metrology, and materials research applications.
Why Choose Our Service:
Partner with us for precision four-point probe measurement solutions that deliver the accuracy, repeatability, and analytical depth your process control and materials characterization demand. Using the KLA R50-4PP system, we provide reliable sheet resistance measurements, comprehensive 2D and 3D uniformity analysis, and expert technical support—helping you maintain tight process control, optimize film properties, and improve device yield with measurement solutions tailored to your specific wafer and thin film requirements.
