Semi-Automatic Probe System | MPI TS2000-SE System
Capabilities:
Our advanced semi-automatic probe system enables functional, electrical parameter, and RF testing of bare dies on wafers. Designed for high-frequency device characterization and flexible operation in semiconductor development and production environments.
Technical Specifications:
RF Test Capability: Integrated RF measurement functionality
Operation Modes: Semi-automatic and manual test modes
Accessory: Auxiliary chuck module
Wafer Size Compatibility: 8-inch wafers
RF Test Frequency: 67 GHz
XY-Axis Resolution: ≤ 0.5 nm
Z-Axis Resolution: ≤ 0.2 μm
Process Advantages:
Dual operation modes offer flexibility for engineering and production
67 GHz RF capability supports high-frequency device characterization
Sub-nanometer XY positioning ensures precise alignment accuracy
High-resolution Z-axis control optimizes probe contact consistency
Auxiliary chuck module enhances testing versatility
Dedicated 8-inch wafer compatibility addresses mainstream applications
Primary Applications:
Functional testing, electrical parameter characterization, and RF performance testing of bare dies on wafers for semiconductor device development, production test, and high-frequency application validation.
Why Choose Our Service？
Partner with us for high-frequency probing solutions that deliver precision, RF integrity, and flexibility. Using the MPI TS2000-SE system, we provide accurate alignment, 67 GHz RF measurement, and expert support—helping you characterize high-speed devices and accelerate product qualification with solutions tailored to your wafer-level test needs.
