Wafer Dicing Saw | Heyan DS9200&C81 System
Capabilities:
Our advanced wafer dicing saw singulates wafers into individual chips through high-speed rotating grinding wheels. Designed for precision cutting in semiconductor packaging applications.
Technical Specifications:
Blade Monitoring: BBD blade detection device
Blade Height Measurement: Non-contact blade height measurement
Process Control: Water curtain and air curtain devices
Max Workpiece Size: 8"
X-Axis Cutting Range: 310 mm
Y-Axis Positioning Accuracy: ≤ 0.002 mm / 310 mm
Process Advantages:
BBD blade detection ensures process stability
Non-contact blade height measurement improves setup efficiency
Water and air curtains minimize contamination
High positioning accuracy delivers consistent cut quality
8" compatibility addresses mainstream packaging requirements
Primary Applications:
Wafer singulation into individual chips for semiconductor packaging and assembly.
Why Choose Our Service？
Partner with us for precision dicing solutions that deliver cutting accuracy, process stability, and contamination control. Using the Heyan DS9200&C81 system, we provide reliable blade monitoring, precise positioning, and expert support—helping you achieve consistent die separation and improve packaging yield with dicing solutions tailored to your wafer singulation requirements.
