Laser Scribing System | Delon AS-5360 System
Capabilities:
Our advanced laser scribing system ablates wafer surfaces through focused high-energy laser beams to form grooves, followed by external force breaking to separate wafers into individual chips. Designed for precision dicing in semiconductor packaging applications.
Technical Specifications:
Laser Type: Solid-state UV laser
Laser Wavelength: 355 nm
Laser Repetition Frequency: 50K–200K Hz
Maximum Laser Output Power: 15 W
Wafer Size Compatibility: 4, 6, 8-inch wafers
Kerf Width: ≤ 12 μm (at 40 μm scribe depth on silicon surface)
Process Advantages:
Solid-state UV laser delivers stable, high-energy output
355 nm wavelength enables precise ablation with minimal thermal damage
Wide repetition frequency range accommodates various process requirements
Multi-size wafer compatibility supports flexible production
Narrow kerf width maximizes usable die area per wafer
Primary Applications:
Wafer grooving via focused laser ablation followed by mechanical breaking for chip singulation in semiconductor packaging and MEMS device fabrication.
Why Choose Our Service?
Partner with us for precision laser scribing solutions that deliver narrow kerf width, minimal thermal damage, and flexible wafer size compatibility. Using the Delon AS-5360 system, we provide stable UV laser ablation, precise groove formation, and expert support—helping you maximize die yield and improve singulation quality with laser scribing solutions tailored to your wafer dicing requirements.
