Laser Stealth Dicing System | Delon Inducer-5680 System
Capabilities:
Our advanced laser stealth dicing system creates micro-cracks inside wafers through focused high-energy laser ablation, followed by external force expansion to separate wafers into individual chips. Designed for damage-free dicing in advanced semiconductor packaging applications.
Technical Specifications:
Laser Type: Solid-state infrared laser
Laser Wavelength: 1342 nm
Laser Repetition Frequency: 0–100K Hz
Maximum Laser Output Power: 5 W
Wafer Size Compatibility: 4, 6, 8-inch wafers
Chipping Size: ≤ 3 μm
Process Advantages:
Solid-state infrared laser delivers stable, controlled energy output
1342 nm wavelength enables internal ablation without surface damage
Zero surface kerf eliminates debris and contamination
Minimal chipping ensures clean die separation
Multi-size wafer compatibility supports flexible production requirements
Primary Applications:
Internal micro-crack formation via focused laser ablation followed by external expansion for chip singulation in advanced semiconductor packaging and thin wafer dicing applications
Why Choose Our Service?
Partner with us for laser stealth dicing solutions that deliver zero surface kerf, minimal chipping, and damage-free singulation. Using the Delon Inducer-5680 system, we provide precise internal ablation, clean die separation, and expert support—helping you maximize die strength and improve singulation quality with stealth dicing solutions tailored to your thin wafer and advanced packaging requirements.
