Flip-Chip Bonder | SET ACCµRA OPTO
Capabilities:
Our advanced flip-chip bonder enables chip-to-chip (C2C) thermocompression bonding, eutectic bonding, and epoxy die-attach processes. Designed for ultra-high precision assembly of optoelectronic and compound semiconductor devices.
Technical Specifications:
Process Environment: Inert gas protection capability
Bonding Processes: Thermocompression, eutectic, and more
Bonding Force Range: 0.2 N – 1000 N
Post-Bonding Accuracy: ±0.5 μm
Maximum Heating Temperature: 450°C
Chip Size Compatibility: 0.2 × 0.2 mm² – 50 × 50 mm²
Process Advantages:
Inert gas environment protects sensitive materials during bonding
Wide force range accommodates fine-pitch to large-area devices
Sub-micron post-bonding accuracy enables high-yield optoelectronic assembly
450°C maximum temperature supports multiple bonding processes
Broad chip size compatibility addresses diverse application requirements
Primary Applications:
Chip-to-chip thermocompression bonding, eutectic bonding, and epoxy die-attach for optoelectronic devices, laser diodes, MEMS, and advanced microelectronic assemblies.
Why Choose Our Service？
Partner with us for ultra-high precision flip-chip bonding solutions that deliver ±0.5 μm accuracy, versatile process capability, and flexible chip size support. Using the SET ACCµRA OPTO system, we provide reliable thermocompression, eutectic, and epoxy bonding—helping you achieve precise optical alignment and robust interconnections with bonding solutions tailored to your most demanding optoelectronic and advanced packaging requirements.
