Laser Solder Ball Bumper | PacTech SB2-JET
Capabilities:
Our advanced laser solder ball bumper enables precision ball placement for optoelectronic devices, MEMS, sensors, camera modules, BGA, and flip-chip applications. Designed for non-contact soldering with high-speed, flexible bumping capability.
Technical Specifications:
Process Control: Precision solder ball dispensing function
Bonding Method: Non-contact laser soldering
Bumping Speed: 10 balls per second
Ball Diameter Range: 40 μm – 760 μm
X/Y Maximum Travel Range: 500 mm
Compatible Solder Materials: SnAgCu, SnAg, SnPb, AuSn, InSn, and more
Process Advantages:
Non-contact soldering eliminates tool wear and mechanical damage
High bumping speed enables high-throughput production
Wide ball diameter range accommodates fine-pitch to large-ball applications
Large X/Y travel range supports panel-level and multi-device processing
Broad solder alloy compatibility addresses diverse assembly requirements
Primary Applications:
Solder ball bumping for optoelectronic devices, MEMS, sensors, camera modules, BGA substrates, and flip-chip wafer-level packaging applications.
Why Choose Our Service？
Partner with us for laser solder ball bumping solutions that deliver non-contact processing, high-speed placement, and broad material compatibility. Using the PacTech SB2-JET system, we provide precision solder ball dispensing, flexible ball size range, and expert support—helping you achieve reliable interconnections and fine-pitch bumping with bumping solutions tailored to your specific advanced packaging and heterogeneous integration requirements.
