Wire Bonder | F&S 53XXBDA
Capabilities:
Our advanced wire bonder utilizes thermal, pressure, and ultrasonic energy to securely bond metal wires to chip and substrate pads, enabling electrical interconnection between chips, chips and substrates, and chips and leadframes. Designed for hybrid microelectronics, multichip modules, and advanced packaging applications.
Technical Specifications:
Maximum Sample Size: 4" × 4
Vertical Bonding Depth: 15 mm
Maximum Bonding Force: 150 cN
Maximum Heating Temperature: 250°C
Wire Diameter Range: 17.5 μm – 75 μm
Bond Head: Multi-function bonding head (ball bonding and wedge bonding capability)
Process Advantages:
Multi-function bond head enables both ball and wedge bonding on a single platform
Wide wire diameter range accommodates diverse device requirements
Deep vertical reach supports complex 3D package configurations
Precise force and temperature control ensure consistent bond quality
4" × 4 work area addresses multi-device and hybrid circuit assembly
Primary Applications:
Electrical interconnection between chips, chips and substrates, and chips and leadframes via thermosonic ball bonding and ultrasonic wedge bonding for hybrid microelectronics, multichip modules, MEMS, and advanced packaging
Why Choose Our Service？
Partner with us for flexible wire bonding solutions that deliver dual-process capability, deep access, and precise process control. Using the F&S 53XXBDA system, we provide reliable ball and wedge bonding, wide wire size compatibility, and expert support—helping you achieve robust interconnections and design flexibility with bonding solutions tailored to your specific hybrid and multichip module packaging requirements.
