Plasma Cleaning System | Nordson March AP-600
Capabilities:
Our advanced plasma cleaning system performs surface cleaning of samples prior to die attach, wire bonding, plastic encapsulation, and other assembly processes. Designed to improve adhesion and process reliability in semiconductor packaging and microelectronic manufacturing.
Technical Specifications:
Wafer Size Compatibility: Up to 12-inch wafers
Chamber Viewing: Observation window
Dry Pump Pumping Speed: ≥28 m³/h
RF Power Frequency: 13.56 MHz
Process Gases: 3 gas lines (O₂, Ar, and spare)
RF Power Range: 0–600 W, fully adjustable
Process Advantages:
Large chamber accommodates 12-inch wafers and multiple devices
Observation window enables real-time process monitoring
High-speed dry pump reduces cycle time
13.56 MHz RF frequency ensures efficient, uniform plasma generation
Multiple gas inputs support various cleaning chemistries
Adjustable RF power provides process flexibility for different substrates and contamination types
Primary Applications:
Surface cleaning prior to die attach, wire bonding, plastic encapsulation, and other assembly processes in semiconductor packaging, MEMS, and microelectronics manufacturing
Why Choose Our Service？
Partner with us for plasma cleaning solutions that deliver consistent surface activation, broad wafer size compatibility, and flexible process control. Using the Nordson March AP-600 system, we provide efficient residue removal, improved bond strength, and expert support—helping you enhance assembly yields and package reliability with cleaning solutions tailored to your specific pre-process requirements.
