Fiber Laser Marking System | Han's Laser YLP-HC20
Capabilities:
Our advanced fiber laser marking system enables fine marking processes on wafer, metal, and other material surfaces. Designed for high-precision, high-speed identification and traceability applications in semiconductor and industrial manufacturing.
Technical Specifications:
Laser Type: MOPA laser
Laser Output Power: 20 W
Laser Wavelength: 1064 nm
Maximum Marking Speed: ≤ 7000 mm/s
Stage Configuration: 2-axis (X, Y) movable worktable
Marking Field Size: 100 mm × 100 mm
Process Advantages:
MOPA laser architecture delivers superior beam quality and pulse flexibility
20 W output power accommodates various material types and marking depths
1064 nm wavelength provides excellent absorption for metals and silicon
High marking speed enables high-throughput production
Precision XY stage ensures accurate positioning across the marking field
Compact marking field size supports single-device and multi-device processing
Primary Applications:
Fine marking and identification on wafer surfaces, metal components, and other engineered materials for semiconductor, packaging, and industrial manufacturing applications.
Why Choose Our Service?
Partner with us for fiber laser marking solutions that deliver high-speed precision, flexible pulse control, and reliable beam quality. Using the Han's Laser YLP-HC20 system, we provide permanent, high-contrast marks, fine feature resolution, and expert support—helping you achieve product traceability and process control with marking solutions tailored to your specific material and throughput requirements.
