Scanning Acoustic Microscope
Capabilities:
Our advanced scanning acoustic microscope enables observation of internal defects in packaged devices including delamination, voids, air bubbles, gaps, and contaminant particles, as well as lattice structure analysis of materials. Designed for non-destructive failure analysis and quality control in semiconductor packaging and materials research.
Technical Specifications:
Transducer Configuration: Dual-probe ultrasonic scanning system
Signal Processing: High-frequency filter
Limit Resolution: 5 μm
Maximum Transducer Frequency: 300 MHz
Maximum Scan Area: 320 mm × 320 mm
Scan Speed: 600 mm/s
Process Advantages:
Dual-probe design enables flexible inspection for different sample types and depths
High-frequency filtering enhances signal-to-noise ratio for clearer imaging
5 μm resolution captures fine internal defects
300 MHz high-frequency transducer provides superior depth resolution
Large scan area accommodates panels, multi-device substrates, and large packages
High scan speed supports production-level inspection throughput
Primary Applications:
Non-destructive inspection of delamination, voids, bubbles, gaps, and contaminant particles in packaged devices, as well as material lattice structure characterization for semiconductor packaging, MEMS, and advanced materials research.
Why Choose Our Service？
Partner with us for scanning acoustic microscopy solutions that deliver high-resolution defect detection, broad frequency capability, and large-area scanning. Using the Zhejiang Lab self-developed system, we provide reliable internal imaging, quantitative defect analysis, and expert support—helping you assess package integrity, identify failure mechanisms, and improve process reliability with inspection solutions tailored to your specific device and material requirements.
