Bond Tester | Dage 4000 Optima
Capabilities:
Our advanced bond tester performs wire bond pull testing, solder ball shear testing, and die shear testing. Designed for process control, quality assurance, and failure analysis in semiconductor packaging and assembly.
Technical Specifications:
Force Modules: 3 shear/pull modules
Sample Fixturing: Customizable sample holders
Calibration: Standard calibration tools included
System Accuracy: ±0.1%
Maximum Pull Force: 10 kg
Maximum Shear Force: 200 kg
Stage Travel Range: 160 mm × 160 mm
Process Advantages:
Three interchangeable force modules cover a wide range of test applications
Customizable fixturing accommodates various package types and sizes
±0.1% system accuracy ensures high measurement confidence
High shear force capacity supports large solder bumps and power devices
Large stage travel enables testing of multi-device substrates and panels
Comprehensive calibration tools maintain long-term measurement integrity
Primary Applications:
Wire bond pull strength testing, solder ball shear testing, and die shear testing for semiconductor packaging, MEMS, optoelectronics, and microelectronic assembly.
Why Choose Our Service?
Partner with us for precision bond testing solutions that deliver high accuracy, broad force range, and flexible fixturing. Using the Dage 4000 Optima system, we provide reliable pull and shear measurements, repeatable test results, and expert support—helping you verify process quality, meet industry standards, and ensure assembly reliability with test solutions tailored to your specific interconnect and package requirements.
