X-Ray Inspection System | Dage Quadra 7
Capabilities:
Our advanced X-ray inspection system enables non-destructive internal inspection of packaged devices, solder joints, and interconnects. Designed for failure analysis, process monitoring, and quality assurance in semiconductor packaging and assembly.
Technical Specifications:
Sample Handling: Carbon fiber sample tray
3D Imaging: μCT scanning module
Feature Recognition Resolution: 0.1 μm
Maximum Sample Weight: 5 kg
Tube Voltage Range: 30 kV – 160 kV
System Geometric Magnification: 2500×
Process Advantages:
Carbon fiber tray minimizes X-ray absorption for clearer imaging
Integrated μCT module enables 3D volumetric reconstruction
0.1 μm feature resolution captures ultra-fine defects and cracks
Wide tube voltage range optimizes contrast for various materials and thicknesses
2500× geometric magnification reveals minute structural details
5 kg sample capacity accommodates heavy components and assemblies
Primary Applications:
Non-destructive inspection of solder joints, interconnects, and internal structures for optoelectronic devices, MEMS, sensors, camera modules, BGA, flip-chip, and other advanced packaging applications.
Why Choose Our Service?
Partner with us for high-resolution X-ray inspection solutions that deliver sub-micron defect detection, 3D imaging capability, and flexible sample handling. Using the Dage Quadra 7 system, we provide detailed internal analysis, quantitative void measurement, and expert support—helping you identify failure mechanisms, optimize assembly processes, and ensure product reliability with inspection solutions tailored to your specific packaging and interconnect requirements.
