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Lithography
COATING PROCESS

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Product Detail


Process introduction
Vacuum coating is the deposiion of a metal or non-metal in the form of a vapor phase onto the surface of a matenial in a vacuum environment to form adense thin film. The quality of the coating is critical to the functional formation of the semiconductor device


Technical application
Metal and ITO materials are mainly used for the preparation of electrodes, while other non-metalic materials are mainly used for the preparation oiinsulatina dielectric lavers and sacrificial mask layers.

Process capability
Mastering Coating Technology
Electron beam evaporation, maanetron sputtering, LPCVD, PECVD, ALD atomic laver deposition coating

Coating Material
Magnetron sputtering: Ti, Al, Ni, Au, Ag, Cr, Pt, Cu, TiW90, Pd, Zn, Mo, W, Ta, Nb, etc
Electron beam evaporation: Ti, Al, Ni, Au, AuGe, Cr, Pt, In, Sn, etc
Chemical deposition: SiO2, SiNx, a-Si

Coated substrate
Silicon wafers, quartz glass wafers, sapphire wafers, PET, Pi, etc
Sub 1: PlutoChip Co., Ltd    -Discrete Devices and Integrated Circuits-    www.plutochip.com
Sub 2: PlutoSilica Co., Ltd   -Silicon Wafer and Glass Wafer Manufactory-
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