Bonding
Bonding is the critical process of permanently joining two ultra-clean, atomically flat semiconductor wafers (homogeneous or heterogeneous) using intermolecular forces. As a foundational step in MEMS manufacturing, selecting the optimal bonding technique is paramount.
It directly determines your device's mechanical stability, hermetic sealing, and ultimate functional success. At Plutosemi, we've mastered a comprehensive portfolio of mature bonding technologies, expertly tailored to meet diverse customer requirements across substrates, thicknesses, temperatures, and pressures.
Applications:
Powering Cutting-Edge MEMS Devices
Our precision bonding technology is essential for manufacturing high-performance, reliable microelectronic components, including:
Microcavity Devices (e.g., pressure sensors, resonators, IR imagers)
Cantilever Beam Structures (e.g., accelerometers, AFM probes)
Devices Utilizing Sacrificial Layers
Complex & Custom 3D MEMS Structures
Capabilities:
Our Advanced Bonding Expertise
Plutosemi delivers robust and reliable bonding solutions for your most demanding applications:
Anodic Bonding: Ideal for glass-to-silicon hermetic seals
Eutectic Bonding: High-strength metal alloy bonds (AuSn, CuSn, AuSi, etc.)
Adhesive Bonding: Versatile solutions using specialized adhesives (AZ4620, SU8)
Thermocompression Bonding: For robust interconnects
Multi-Layer Bonding: Complex stack assembly
Silicon Fusion Bonding: Direct Si-to-Si joining for high integrity
Inverted Bonding: Enabling unique device architectures
